Motorola has a large web page on PBGAs.
Layout, assembly, rework, reliability, stress, mechanical outlines and
more.
Access!Motorola: PBGA Introduction
http://mot-sps.com/solutions/wired/pbga/pbga.html
Also look at
http://mot-sps.com/books/apnotes/pdf/an1231rev2a.pdf
Stats: 707286 bytes, Last Update: Jul 18 1997
Thanks, Jeff, for the pointer.
Roland
Jeff Seeger wrote:
> Roland F. Portman wrote:
> >
> > Do you know if there has been any research on the use of BGA's in an
>
> > Industrial
> > environment (-40C to +85C combined with moderate to severe shock and
>
> > vibration).
> > I am afraid the different tCE of the BGA and the PWB (FR4) over
> that
> > temperature
> > extreme will cause the balls to crack and fail.
>
> Two methods of miminizing the tCE issue are the use of
> Columns rather than Balls and the use of an underfill.
>
> > Perez, Raul wrote:
> >
> > > There is a Joint Industry Standard by both the IPC and the EIA on
> > > Implementation of Ball Grid Array and other High Density
> Technology.
> > >
> > > J-STD-013
> > >
> > > Check out these pages for more info.
> > > http://www.ipc.org
> > > http://www.eia.org
> > >
> An additional resource is Motorola's application note
> AN1231, available as a pdf file on their web site. Afraid
> you'll have to perform a search as I did not keep the link.
>
> Regards to all,
> --
>
> Jeff Seeger Applied CAD Knowledge
> Inc
> Chief Technical Officer Tyngsboro, MA
> 01879
> jseeger "at" appliedcad "dot" com 978 649
> 9800
-- Roland F. Portman BiT Microsystems, Inc. 48499 Milmont Drive Fremont, CA 94538(510) 623-2341 Ext 129 (510) 623-2342 Fax
[email protected] http://www.bitmicro.com
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Motorola has a large web page on PBGAs.
Layout, assembly, rework, reliability, stress, mechanical outlines and more.Access!Motorola: PBGA Introduction
http://mot-sps.com/solutions/wired/pbga/pbga.html
Also look at
http://mot-sps.com/books/apnotes/pdf/an1231rev2a.pdf
Stats: 707286 bytes, Last Update: Jul 18 1997Thanks, Jeff, for the pointer.
Roland
Jeff Seeger wrote:
Roland F. Portman wrote:
>
> Do you know if there has been any research on the use of BGA's in an
> Industrial
> environment (-40C to +85C combined with moderate to severe shock and
> vibration).
> I am afraid the different tCE of the BGA and the PWB (FR4) over that
> temperature
> extreme will cause the balls to crack and fail.Two methods of miminizing the tCE issue are the use of
Columns rather than Balls and the use of an underfill.> Perez, Raul wrote:
>
> > There is a Joint Industry Standard by both the IPC and the EIA on
> > Implementation of Ball Grid Array and other High Density Technology.
> >
> > J-STD-013
> >
> > Check out these pages for more info.
> > http://www.ipc.org
> > http://www.eia.org
> >
An additional resource is Motorola's application note
AN1231, available as a pdf file on their web site. Afraid
you'll have to perform a search as I did not keep the link.Regards to all,
--Jeff Seeger Applied CAD Knowledge Inc
Chief Technical Officer Tyngsboro, MA 01879
jseeger "at" appliedcad "dot" com 978 649 9800--
Roland F. Portman
BiT Microsystems, Inc.
48499 Milmont Drive
Fremont, CA 94538(510) 623-2341 Ext 129
(510) 623-2342 Fax[email protected]
http://www.bitmicro.com
--------------1C558E29BFA1F2E6C24BDEC6--