From: [email protected]
Date: Tue Nov 14 2000 - 06:44:23 PST
Ozgur,
I don't expect you to get reliable data on the current carrying capacity of
chip bumps or solder balls for two reasons. 1) in many of the bump
technologies in use today, the factor limiting the current is not the size
of the solder connection, it is the interface between the solder and the IC.
2) since the limit is in the interface, it is usually confidential
information.
Aubrey Sparkman
Signal Integrity
[email protected]
(512) 723-3592
> -----Original Message-----
> From: Ozgur Misman [mailto:[email protected]]
> Sent: Monday, November 13, 2000 7:03 PM
> To: [email protected]
> Subject: [SI-LIST] : current carrying capacity of chip bump and solder
> ball??
>
>
>
>
> Hi Everybody,
>
> I was wondering if anyone had a reliable data on the current
> carrying capacity
> of chip bump (flip-chip) and solder ball with respect to
> diameter, mounted
> height, etc? If you have any information to share or can poin
> to a reliable
> reference I would appreciate it.
> Thanks in advance
> Ozgur Misman
> Sr. Engineer
>
>
>
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