From: Brian Seol ([email protected])
Date: Tue Oct 03 2000 - 18:27:44 PDT
Dear All,
Does anyone have some approximate numbers for the limit of current that will
flow through the wire bonding for a power pad of the single chip package?
If that depends on the number of wire, how many wire do I need to handle
current of 3A in case of 25 micron diameter gold bond wire? Any comments
will be appreciated.
Brian Seol
Tessera Inc.
**** To unsubscribe from si-list or si-list-digest: send e-mail to
[email protected]. In the BODY of message put: UNSUBSCRIBE
si-list or UNSUBSCRIBE si-list-digest, for more help, put HELP.
si-list archives are accessible at http://www.qsl.net/wb6tpu
****
This archive was generated by hypermail 2b29 : Tue May 08 2001 - 14:29:39 PDT